28^th International Conference on Advanced Materials July 21-22, 2021 New York, USA

Special Advisor, Japan Advanced Chemicals * Professor Emeritus of Mie University (Japan) * Honorary Professor of Southwest Jiaotong University (Chengdu, China) * Representative of MRS-Japan Research Society (Nano Oxides Materials) * Representative of Team Harmonized Oxides (THO) * Visiting Researcher, University of California-San Diego, USA (1995).

Oxide Thin Films, * Multifunctional Oxide Composites and Heterostructures, * Plasma Effects on Polymer Films and Tight Bonding, * Plasma on Carbon Fibers, * Mineral Materials, Bio Materials.

Masahiro YOSHIMURA was graduated for B.S. at 1965, M.S. at 1967 and D. Sc. in Engineering at 1970 from Tokyo Institute of Technology, Japan. Then 1970,Research Assoc.,1978 Assoc. Prof. ,1985 Full Prof. in Materials and Structures Laboratory, Tokyo Institute of Technology. During those periods, 1973-1975 Post Doc. in 3 CNRS Labs.(Odeillo, Orleans and Paris) in France, and 1975-1977 in Mass. Inst. Tech., USA. He was the Director of Center for Materials Design for 1996-2002. He retired at 2008, Professor Emeritus,from Tokyo Institute of Technology. After experienced several Visiting/Guest Profs. In Tohoku Univ., Japan, Univ. Limerick, Ireland, ETH Zurich, Switzerland, Inst. Metal. Res., CAS, Shenyang, China, etc. he has been in National Cheng Kung Univ., Taiwan since Feb. 2010 as a Visiting Chair Prof. then now Distinguished Chair Prof. and Director of Promotion Center for Global Materials Research , NCKU, since July 2011. He received ,Academic Award (1993) from The Ceramic Soc. Japan, 10th Fulrath Pacific Award(1987) and Fellow(1995) from The Amer. Ceram. Soc., International Award(2001) from European Ceramic Soc., IUMRS Somiya Award for International Collaborative Work, IUMRS(2002), Honorary Members in MRS –India (2003), Research Award, Ministry of Education, Culture & Science, Japan(2007), Lee Hsun Award, Institute of Metal Research, CAS, Shenyang, China(2008) and Honorable Permanent Resident Visa,Taiwan(2012), Honorary Fellow of European Ceramic Society(2017),Distinguished Life Member from Amer. Ceram. Soc.(2017)　.etc.He is nominated form Thomson-Reuter as ISI Highly-Cited Researcher(2001).

Soft ceramic processes Inorganic material processes Nano composite materials

Dr. Huamin Li received the BS degree from the College of Physics and Electronics, Shandong Normal University, Jinan, China, in 2007, the MS degree from the College of Engineering, Sungkyunkwan University (SKKU), Suwon, Korea, in 2010, and the PhD degree in the Department of Nano Science and Technology, SKKU, Suwon, Korea, in 2013. His PhD research focused on 2D electronics and optoelectronics. Subsequently, he worked as a postdoctoral research associate in the Department of Electrical Engineering, University of Notre Dame. His postdoctoral work included the development of low-voltage and steep subthreshold swing (SS) components for beyond-CMOS electronic systems using low-dimensional materials. To date, his research results have been included in one book chapter (2013), published in Nature Communications (2015), Scientific Reports (2014), IEEE Transaction on Electron Devices (2009–2012) etc., presented in IEEE International Electron Devices Meeting (IEDM, 2009, 2011–2013), and filed five US and Korean patents with the collaboration of Samsung Electronics Co., Ltd. In 2012, he received Chinese Government Award for outstanding self-financed students abroad by China Scholarship Council.

Nano-scale electronics and optoelectronics based on low-dimensional materials

Dr. Osman Adiguzel graduated from Department of Physics, Ankara University, Turkey in 1974 and received PhD- degree from Dicle University, Diyarbakir-Turkey. He studied at Surrey University, Guildford, UK, as a post doctoral research scientist in 1986-1987, and his studies focused on shape memory alloys. He worked as research assistant, 1975-80, at Dicle University and shifted to Firat University in 1980. He became professor in 1996, and he has already been working as professor. He published over 50 papers in international and national journals; He joined over 100 conferences and symposia in international and national level as participant, invited speaker or keynote speaker with contributions. He served the program chair or conference chair/co-chair in some of these activities. In particular, he joined in last four years (2014 - 2017) over 30 conferences as Keynote Speaker and Conference Co-Chair organized by South Asian Institute of Science and Engineering (SAISE), web: http://saise.org/, Science and Engineering Institute (SCIEI), web: http://www.sciei.org, International Association of Computer Science and Information Technology, web: http://www.iacsit.org/, The Academic World Education and Research Center (AWER-Center), web: http://www.awer-center.org/, and other institutes and companies. Dr. Adiguzel served his directorate of Graduate School of Natural and Applied Sciences, Firat University in 1999-2004. He supervised 5 PhD- theses and 3 M.Sc theses. He is also Technical committee member of many conferences. He received a certificate which is being awarded to him and his experimental group in recognition of significant contribution of 2 patterns to the Powder Diffraction File – Release 2000. The ICDD (International Centre for Diffraction Data) also appreciates cooperation of his group and interest in Powder Diffraction File.

His research interests are Shape memory effect and displacive phase transformations in shape memory alloys and other alloys, molecular dynamics simulations, alloy modeling, electron microscopy, x-ray diffraction and crystallography.

Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, Technical University, Vienna, Austria and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 450+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. His most recent awards are 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and 2019 Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement award for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.

Applied Mathematics and Mechanics, Applied and Mathematical Physics, Analytical (Mathematical) Modeling in Applied Science and Engineering,Materials Science and Engineering, Aerospace and Automotive Electronics and Photonics Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Assemblies, Packages and Systems, Applied Probability and Probabilistic DfR (PDfR) of Electronic and Photonic Materials, Devices and Systems Photonics, Fiber Optics, Mechanics of Optical Fibers, Thin Film Mechanics and Physics Shock and Vibration Analyses and Testing, Dynamic Response of Materials and Structures to Shocks and Vibrations Thermal Stress Analysis, Prediction and Prevention of Thermal Stress Failures in Electronics and Photonics Solder Materials and Solder Joint Interconnections in Electronic and Photonic Engineering, Polymeric Materials in Electronics and Photonics,